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The plastic used in ICs is typically an epoxy resin, as opposed to a thermoplastic. A thermoplastic will melt and solidify with temperature, whereas as an epoxy will set through a chemical reaction and won't melt. They are also mechanically rigid, excellent electrical insulators, anhydrous  and chemically inert, all of which are anywhere between highly desirable and required features for devices used in production of electronics. Now, the problem is that most or all bioplastics are thermoplastics. This is great for 3D printing, but not so great for chips.

For example, you'd be hard pressed to find a bioplastic which has a high enough melting point to tolerate soldering which will reach a minimum of 200 ºC for reflow soldering, more for other methods, including manual soldering with a soldering iron.
Other problems that I would predict: Poor bonding to the die and bond wires, which will let moisture creep in and destroy the die. Poor heat conductivity. Might melt or otherwise react with the die and destroy it. Might melt from the heat generated by the die and become a good enough conductor on the microscopic level to create faults. Might have unsuitable dielectric properties and leak high frequency signals between different  nearby traces on the die.

But the kicker is that the tiny amount of plastic used in the production of a chip i probably the least of the problems environmentally speaking. A typical consumer product will contain in the order of hundreds to thousands amount the plastic used in the chip in the case. Producing the die requires the use of various nasty chemicals, for example trichloroethylene which is used for washing the die. Any serious manufacturer will keep their trichloroethylene in a closed loop system, but to mention a famous example, there was a leak in the facilities of MOS Technology, Commodore's chip plant, which forced the city to build a water pipeline from a nearby city because the groundwater was ruined. How do the less scrupulous Chinese IC manufacturers dispose of their chemicals I wonder?

But my bottom line, and this may perhaps sound a bit hostile, is that you can't just slap a buzzword onto an industrial process. If something hasn't been tried it's often because it's not a good idea.

Have you tried the Snow scheme?

It works on the GBA. It's just that you can't put an old GB program on a GBA cartridge.

Actually, I realize I have a really old (and dirty) DMG that I bought cheaply on an auction for its low serial number, and it has this problem. Unfortunately, after a quick analysis, I don't think the particular problem is related to bad/low value capacitors, but how the sound circuit in the CPU chip is constructed. It seems like when you turn the wave channel off, (which has to be done to reload the sample buffer) it returns to a DC level way outside of the amplitude range of the wave channel. My antispike fix isn't of much help either. Unfortunately, I don't think the problem is fixable. I will try some things, but don't keep your hope up.

It's a competition cartridge which Nintendo used for competitions on game fairs and similar events.

The reason there is a download link is because it would be easy to download the file anyway (unless you put in some complex protection against it, which we didn't feel like doing.) Even Bandcamp lets you listen to the tracks, and with a little bit of magic, download them without paying. But iirc, the available files are in a lower quality, like 128 kbps MP3, so that is supposed to be the discouragement against that.

Ah, that's why I asked. I've heard OSX can be unreliable for MIDI sysex. Possibly related, I found this:

http://stackoverflow.com/questions/8148 … osx-broken

tl;dr MIDI commands can be timestamped, and this is not recommended for sysex messages. I wonder what the NL transfer application does. Perhaps I should contact Oliver about this and check...